盛合晶微半导体（江阴）有限公司
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Company Profile
Media Room
Grand Opening Ceremony of SJSemi's J2B Fab: First Batch of Domestic Equipments Fuels Expansion of 3D Multi-Die Integration Packaging Project 2023-07-20 16:06
SJSemi Signed $340 Million of C+ Financing 2023-04-04 21:57
SJSemi Successfully Closed $300M of Series C Financing 2022-03-16 18:07
SJSemi Funded by $300M of Series C Financing 2021-10-08 18:52
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