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Axiomtek Teams with Leading AI Chipmaker Hailo to Launch Palm-sized Edge AI Computer - Aristotle (RSC101) 2022-03-22 08:52
Toshiba's New Palm-sized Projector Unit Pushes LiDAR's Detection Range to 300m, the World's Longest, with Industry-leading Image Quality 2022-03-18 10:00
Pixelworks Powers HONOR Magic4 Series to Take the Lead of High-End Smartphone Market 2022-03-17 21:56
Rafay Systems Powers AI and Machine Learning Applications at the Edge by Streamlining Operations for GPU-based Container Workloads 2022-03-17 21:03
Global Semiconductor Materials Market Revenue Tops $64 Billion in 2021 to Set New Record, SEMI Reports 2022-03-16 22:13
SJSemi Successfully Closed $300M of Series C Financing 2022-03-16 18:07
Mouser Electronics Launches 2022 Empowering Innovation Together Program with New Podcast on RISC-V 2022-03-16 14:40
Intel to Invest €17 Billion in German Chip Gigafactory 2022-03-16 09:00
Fujitsu Launches 12Mbit ReRAM -- Largest Memory Density in ReRAM Family 2022-03-15 15:00
Xailient blows the doors off Computer Vision with Intel OpenVINO at 448FPS - opening the way for advanced applications in Face Recognition and Privacy 2022-03-14 23:17
Mycronic receives order for an SLX mask writer 2022-03-14 16:06
Exfoliation of Zeolites into Solution Produces Porous Monolayers: WPI-MANA 2022-03-14 16:00
Addibond™ obtains Solar Impulse Efficient Solution Label 2022-03-14 08:00
ChipMOS REPORTS RECORD FEBRUARY 2022 REVENUE 2022-03-10 19:00
ChipMOS to Present at 2022 BAML Asia Pacific TMT Conference 2022-03-09 19:00
Arasan announces the immediate availability of its MIPI D-PHY(SM) IP as Tx Only or Rx Only for the GlobalFoundries 12nm FinFET process node. 2022-03-09 02:00
Artilux Demonstrates New Breakthrough for Multi Spectral Optical Sensing 2022-03-08 16:16
The Chip Shortage Forecast to Significantly Constrain SIM Cards Market through 2022 2022-03-03 21:30
PNY adds value and commitment in Singapore via new distribution partnership with Kaira Singapore 2022-03-03 13:36
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits 2022-03-02 22:00
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