omniture

Texas Instruments Single-Chip Cell Phone Technology Will Make Multimedia Phones Affordable for Mass Market

Texas Instruments Incorporated
2006-11-09 12:41 3706

New OMAP-Vox(TM) Single-Chip Platform Supports EDGE, Enables Software Reuse

for Faster and More Cost-Effective Multimedia-Rich Feature Phone Development

BEIJING, China, Nov. 9 /Xinhua-PRNewswire/ -- During a summit of wireless

industry leaders held today in Beijing, China, Texas Instruments Incorporated

(NYSE: TXN) (TI) announced a new OMAP-Vox(TM) single-chip solution to foster

development of lower-cost multimedia-rich feature phones. Codenamed

“eCosto,” the new single-chip platform is leveraging TI’s innovative DRP

(TM) technology which is successful with the “LoCosto” value platform in

volume production today. The “eCosto” platform also leverages the

multimedia capabilities of the OMAP-Vox platform in volume production today

with the OMAPV1030 solution. The first product in the new “eCosto”

platform will be the OMAPV1035 single-chip solution, which will be

manufactured in 65-nanometer (nm) and will support GSM, GPRS and EDGE

standards.

(Logo:

http://www.prnasia.com/upload/story_attchment/20061107170439-

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The “eCosto” platform represents the latest advancement in TI’s

sophisticated and integrated DRP technology, a pioneering approach to

wireless chip design which applies digital technology to simplify radio

frequency (RF) processing in advanced CMOS process technology. Integrating

the RF transceiver and analog codec with the digital baseband significantly

reduces board space, extends battery life, and makes for a more powerful and

versatile handset.

With the new OMAPV1035 single-chip solution, customers currently using

TI’s “LoCosto” platform and OMAP-Vox processors will be able to easily

expand their handset portfolio with competitive, affordable multimedia-rich

handsets. As the current OMAPV1030 and new OMAPV1035 solutions share a

common software platform, OMAP-Vox customers will be able to re-use their

application and modem software investments for faster and more cost-effective

multimedia-rich feature phone development. TI today also announced work with

leading application software providers to further boost rapid integration of

multimedia applications into handsets (for additional details on this

program, go to http://www.ti.com/omapv1035 ).

“As the emerging markets evolve beyond voice-centric, basic multimedia

applications, we must support the integration of more advanced multimedia

features into our single-chip cell phone solutions,” said Alain Mutricy, TI’

s Vice President and General Manager of Cellular Systems Solutions for its

Wireless Terminals Business Unit, during a press conference at today’s

summit. “Now ramping into mass production with ‘LoCosto’ solutions, we

are taking our DRP single-chip technology to the next level with the

‘eCosto’ platform, dramatically lowering system costs of advanced

multimedia handsets.”

China is among the world’s largest mobile phone market with more than

400 million subscribers today and expected annual growth of 15-20%, according

to market analyst firm In-Stat Group. In-Stat also sees a rise in multimedia

adoption in China, driven by music and camera features on the mobile phone.

The OMAPV1035 solution, specifically designed as a cost-effective, multimedia-

rich solution, makes it the natural choice for next generation advanced GPRS

or EDGE handsets.

The “eCosto” platform multimedia-rich capabilities include advanced

video capture, playback and streaming with up to QVGA screen quality at 30

frames-per-second; digital still camera up to three megapixels with sub-

second shot-to-shot delay; color LCD; and interactive 2D/3D gaming with

graphics comparable to that of portable video consoles. The OMAPV1035

solution boasts high-speed hardware-accelerated Java and 3D graphic

processing up to 100-K polygons-per-second. The OMAPV1035 solution is the

industry’s first ARM9(TM) fully integrated single-chip digital baseband with

DSP in 65nm, addressing the power challenge for performance-hungry multimedia-

intensive applications, as well as the requirement for smaller solutions with

more functionality.With the new “eCosto” single-chip platform, TI continues

to deliver on its single-chip roadmap, further supporting the adoption of

wireless technology in emerging countries. In 2004 TI introduced the

industry’s first single-chip solution for mobile phones. To date, more than

15 handset manufacturers worldwide have adopted TI’s “LoCosto” single-chip

platform to offer affordable GSM/GPRS handsets. Enabled by TI’s DRP

technology, handsets based on the “LoCosto” value platform range in

capability from voice-only GSM phones with black and white displays to more

advanced handsets with robust features such as MP3, Bluetooth(R) solutions,

and megapixel cameras. The emerging markets are expected to represent the

next billion subscribers by 2010 (source: GSM Association), demonstrating

significant potential for continued wireless growth.

Availability

The OMAPV1035 single-chip solution will sample in first half 2007 and

will be in production in 2008. The OMAPV1030 solution is in mass production

in handsets today. For more information on the OMAPV1035 solution, go to

http://www.ti.com/omapv1035 .

Texas Instruments -- Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the

heart of today’s wireless technology and building solutions for tomorrow.

TI provides a breadth of silicon and software and 15 years of wireless

systems expertise that spans handsets and base stations for all

communications standards, wireless LAN, Bluetooth, A-GPS, mobile TV and Ultra

Wideband. TI offers custom to turn-key solutions, including complete

chipsets and reference designs, OMAP(TM) application processors, as well as

core digital signal processor and analog technologies built on advanced

semiconductor processes. Please visit http://www.ti.com/wirelesspressroom

for additional information.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog

technologies to meet our customers’ real world signal processing

requirements. In addition to Semiconductor, the company’s businesses include

Educational & Productivity Solutions. TI is headquartered in Dallas, Texas,

and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the

symbol TXN. More information is located on the World Wide Web at

http://www.ti.com .

Trademarks

OMAP and OMAP-Vox are trademarks of Texas Instruments. All registered

trademarks and other trademarks belong to their respective owners.

Source: Texas Instruments Incorporated
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