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WiMi Hologram Cloud Builds A 3D Computer Vision-based HCI System 2023-05-17 20:00
Samsung Electro-Mechanics develops the world's highest capacity MLCC for electric vehicles 2023-05-17 18:34
ChipMOS REPORTS APRIL 2023 REVENUE 2023-05-10 18:00
Kynix at PCIM Europe 2023 - A strong eye-catcher 2023-05-10 15:09
MediaTek Pushes Flagship Smartphone Performance Further with the Dimensity 9200+ 2023-05-10 15:00
ProQure and Identiv Partner to Launch Innovative NFC Type 2 Tags for Large-Scale NFC Deployments 2023-05-05 18:00
"Nexlim", the world's thinnest magnetic component, LG Innotek Wins 'Edison Awards', the Most Prestigious Invention Award in the US 2023-04-27 21:00
Roan Holdings Group Co., Enters into Investment Cooperation Agreement for Development and Manufacturing of LCOS Micro-Display Panels 2023-04-26 20:00
SK hynix Reports First Quarter 2023 Financial Results 2023-04-26 07:29
ChipMOS SCHEDULES FIRST QUARTER 2023 FINANCIAL RESULTS CONFERENCE CALL 2023-04-20 18:00
Kynix will attend PCIM Europe 2023 from May 9th to 11th 2023-04-20 11:22
SK hynix Develops Industry's First 12-Layer HBM3, Provides Samples To Customers 2023-04-20 08:00
EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite 2023-04-20 07:00
Nano Labs Files Annual Report on Form 20-F for Fiscal Year 2022 2023-04-19 19:00
Baidu Apollo Releases Major Product Updates to Help Manufacturers Build Smarter Cars for Tomorrow 2023-04-17 10:15
WiMi Develops a 3D Object Recognition System Based on Multi-View Feature Fusion 2023-04-13 20:00
WiMi Develops An EOG-based VR Interaction System for Intelligent HCI Model 2023-04-11 20:00
ISLE 2023 Concludes with Booming Success in Shenzhen, China's LED Production Hub 2023-04-10 18:07
DEEPX and Hyundai Motor Company and Kia Corporation are collaborating on AI semiconductor-based Robot Platforms 2023-04-07 21:00
JCET Accelerates Technology Upgrades and Transformation in 2022, Maintaining a Leading Edge in High Value-added Applications 2023-03-30 19:38
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