3GHz Multi-Core Baseband Product Addresses Future Needs of OFDMA/LTE Air
Interfaces
HONG KONG, Dec. 4 /Xinhua-PRNewswire/ -- Texas Instruments Incorporated
(TI) (NYSE: TXN) today announced its newest 3GHz-performing wireless
infrastructure baseband product that boosts applications for GSM-based base
stations while addressing new markets and requirements for WiMAX and TD-
SCDMA. With three cores running at 1GHz each, the TMS320TCI6487 processor
enables base station manufacturers to extend their existing designs while
entering into new markets, requiring small form factor applications with an
exceptional scaleable, flexible solution. For more information, please visit
http://www.ti.com/tci6487 .
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“Wireless infrastructure requirements are constantly changing and
evolving, with regional and form factor opportunities growing quickly,” said
Flint Pulskamp, wireless semiconductor analyst at IDC. “Offering a single,
flexible solution to manufacturers and service providers to solve their needs
for quick regional deployments for GSM, TD-SCDMA and WiMAX further
strengthens TI’s strong position in this market space.”
Single Solution for Multiple Standards
Currently, there are more than two billion GSM subscribers in 210
countries around the world. With TI’s TCI6487, manufacturers will be able to
deliver a high-performance, low-cost infrastructure solution for this market
that supports up to 10 EDGE-enabled carriers with a single chip. In addition
to supporting more users, the multi-core DSP provides enhanced capabilities
for GSM, including interference cancellation and better reception for high
data-rate applications. This flexible, software upgradeable solution reduces
overall infrastructure costs, enabling service providers to deploy baseband
technology in new emerging markets such as those in India, Russia, Africa and
South America.
Texas Instruments’ TCI6487 is also optimized for infrastructure designs
of TD-SCDMA, China’s unique air interface. With pre-commercial trials
currently underway for TD-SCDMA, it is anticipated that the standard will be
widely deployed in advance of the 2008 Olympic Games in Beijing, requiring a
solution that can immediately meet the needs of this huge cellular market.
The 3GHz “baseband on a chip” can support three carriers and 69 users per
device.
Building on TI’s current WiMAX leadership, the TCI6487 is an excellent
solution that meets the unique needs of today’s emerging OFDMA requirements
and tomorrow’s LTE demands. The single-chip DSP solution, works in
conjunction with TI’s optimized software library, complete analog front end
and key products from third parties. Now, TI’s WiMAX customers can quickly
get to market with advanced products for current requirements and the ability
to shrink as future smaller form factor requirements demand. A complete 10-
MHz, 2-antenna, 3-sector solution can easily be implemented, improving
overall cost and power per channel.
“Flexibility is key in infrastructure design, as the market constantly
evolves and infrastructure requirements change to support newer features and
services,” said Jerold Givens, TI Communications Infrastructure DSP
director. “While we have insight into what the next paradigm shift is
likely to be in the wireless space in the coming years, it is important for
us to offer our customers a solution that is flexible enough to meet a
variety of today’s industry requirements and powerful enough to take them to
tomorrow’s next phase in wireless infrastructure design.”
Higher-Performance DSP Baseband Solution
TI’s TCI6487 offers three-times the performance of previous
infrastructure solutions, providing greater channel enhancement and more
flexibility while reducing design complexity for OEMs. Manufactured in 65nm
process node, this new DSP is the highest performing processor in TI’s
TMS320C64x+ DSP family. As a result, carriers will be able to deploy advanced
networks quickly while future proofing their investments. The ability to
upgrade performance with software enhancements also enables service providers
to support emerging standards such as LTE, 3GPP and 3GPP+, while easily
adding new features and services to their networks. This, in turn, will
provide subscribers access to the latest and greatest services and
capabilities that the wireless world can deliver.
TI offers the industry’s broadest wireless infrastructure product
portfolio, spanning the complete signal chain. Supporting analog products
include digital up/down converters, high speed data converters, RF products,
timing, backplane interface and standard logic components. Highlighting the
company’s leadership in power management, TI has developed a non-isolated
DC/DC power module with extremely fast response and high performance. It is
the first power management device to meet core voltage tolerance requirements
of the TCI6487.
Availability
The TCI6487 is currently sampling with targeted customers. It will be on
display at the ITU Telecom show, Dec. 4-8 in Hong Kong in Hall 2, Booth 2010.
For more information, please visit http://www.ti.com/tci6487 .
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog
technologies to meet our customers’ real world signal processing
requirements. In addition to Semiconductor, the company includes the
Educational & Productivity Solutions business. TI is headquartered in Dallas,
Texas, and has manufacturing, design or sales operations in more than 25
countries.
Texas Instruments is traded on the New York Stock Exchange under the
symbol TXN. More information is located on the World Wide Web at
http://www.ti.com .
Safe Harbor Statement
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availability and other statements of management’s beliefs, goals and
expectations may be considered forward-looking statements as that term is
defined in the Private Securities Litigation Reform Act of 1995, and are
subject to risks and uncertainties that could cause actual results to differ
materially from those expressed or implied by these statements. The following
factors and the factors discussed in TI’s most recent Form 10-K could cause
actual results to differ materially from the statements contained in this
news release: actual market demand for amplifier products and TI products
specifically, and actual test results relating to TI products. TI disclaims
any intention or obligation to update any forward-looking statements as a
result of developments occurring after the date of this news release.
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