FREMONT, Calif., July 27, 2018 /PRNewswire/ -- CIOReview, a leading US science and technology review magazine, has released the list of "20 Most Promising HPC Solution Providers". Inspur is listed as a global leading HPC solution provider.
Each year, CIOReview assesses HPC providers across a number of factors, including product innovation, proprietary technologies, solution development, market share and customer satisfaction. Of these, 20 companies are highlighted for their rapid expansion of influence among customer groups, contribution to the development of HPC technology applications, and potential for growth. This ranking has been recognized by an increasing number of customers and providers of HPC solutions. CIOReview recognizes that the biggest advantage of Inspur's futuristic solutions is that it helps businesses become more agile and keep pace with evolving needs. It delivers holistic, enterprise-specific solutions aligned with the client's organizational goals.
Inspur boasts a comprehensive product line of HPC hardware, providing application optimization, system software development and a range of other HPC services. Its innovative product portfolio provides solutions covering air/liquid-cooling systems, and two-socket, 4-socket, 8-socket and 32-socket server node products. Among these is the i48, Inspur's latest server launched at the International Supercomputing Conference 2018 (ISC18), a high-density computing module that supports the IT infrastructure required by AI, HPC and NFV. It can complete consistent, high-density and rapid deployment of an entire system as well as flexibly configure compute and storage nodes according to application data capacity and processing performance requirements. Inspur ranks No.1 in China's 2017 TOP100 HPC list, and the third in the 2018 global HPC TOP500.
Supercomputing development is increasingly centering around the convergence of HPC and AI, a trend which has opened up a new, rapidly growing application field for traditional HPC. Companies including Facebook, Google, Microsoft, Baidu and Alibaba have established HPC computing systems applied to AI ML/DL. The global AI market is forecast to rise from nearly 8 billion dollars in 2016 to over 47 billion dollars in 2020, with a compound annual growth rate reaching 55.1%. Growth in AI capabilities is emerging as the deciding factor in the HPC industry.
In addition to Inspur's strong customer base through the convergence of HPC and AI, growth potential as well as HPC and AI innovative capabilities have won Inspur its wide reputation and the customers' trust. When Central China Normal University, a leading Chinese educational institution, recruited Inspur's services to address its computational needs, Inspur provided a 1 PFLOPS cluster based on "NVLin+Volta" GPUs, for accelerating research in frontier physics and AI autonomous vehicle, a typical example of the converge between HPC and AI, according to Vangel Bojaxhi, the Global AI and HPC Director of Inspur, in an interview with CIOReview.
Inspur is using its unique insights to build a strategic framework for AI infrastructure development. With its four-layered AI core competencies -- computing platform, management suite, optimization framework and application acceleration -- Inspur is able to provide holistic AI infrastructure services such as GPU and FPGA AI servers; AIStation, the deep learning and training Cluster Resource management software; Teye, the AI application performance tuning system; and Caffe-MPI, the open source cluster version of Caffe Deep Learning framework. Inspur is also working collaboratively to build AI industrial ecosystems, aiming to provide holistic end-to-end AI solutions for users and facilitate the commercialization of AI in more scenarios. According to the latest IDC report, Inspur held a 57% market share in AI servers in China in 2017.
"Our firm aims to amplify the capabilities of enterprises worldwide by engineering innovative, customized, economic, world-class solutions by leveraging AI and HPC to their highest potential," said Vangel Bojaxhi in the interview.
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